The following methods can be used to improve the heat dissipation efficiency of all in one computers in a limited space:

1. Optimize placement and physical heat dissipation

• Keep the bottom ventilated

     Use a heat dissipation bracket or a self-made padding device (such as a bottle cap or a book) to raise the body by 1-2cm to increase the bottom air intake space.

• Improve ambient airflow

     Avoid placing the device in a closed cabinet or against a wall, ensure that there are no obstructions within 10cm around, and use the natural flow of air to dissipate heat.

• External active heat dissipation device

    Use a low-noise heat dissipation base or a small USB fan to assist in heat dissipation at the back/bottom of the body.

2. Internal maintenance and hardware adjustment

• Regularly clean up dust accumulation

     Remove the back cover every six months (refer to the model disassembly guide), and use a soft brush or compressed gas tank to clean the dust on the cooling fan and heat sink.

• Replace the thermal conductive medium

     If the device has been used for more than 2 years, you can reapply high thermal conductivity silicone grease (such as Shin-Etsu 7921) to enhance the contact efficiency between the CPU/GPU and the heat dissipation module.

• Add auxiliary heat sinks

Paste copper heat sinks on the motherboard heating components (such as power supply modules) and passively dissipate heat through the metal D shell (make sure the internal space allows).

3. Software and usage habits optimization

• Reduce hardware load

    Adjust the system power management to "energy saving mode" or use tools (such as Intel XTU) to limit the peak power consumption of CPU/GPU to reduce continuous high-load operation .

• Close non-essential background programs

      Reduce processes that occupy resources such as browser tabs and self-starting software to avoid hardware overheating .

4. Low-cost DIY solution

• Improvement of air flow duct : Add plastic guide plates (such as cut beverage bottles) to the heat dissipation outlet to concentrate the air flow direction and improve the heat dissipation efficiency .
• Metal D shell auxiliary : If the body is made of metal, you can paste thermal conductive paste to transfer the internal heat to the outer shell and use the ambient air to dissipate heat naturally .

Through the above combination of solutions, the heat dissipation effect can be significantly improved in a limited space, while taking into account cost and safety. Note that the disassembly operation should be cautious. It is recommended to consult the equipment manual or consult a professional . Shenzhen Wandong's latest K11/K18 series all-in-one computer products use a unique cooling system. For more information, please visit www.wd-allinonepc.com