The following methods can be used to improve the heat dissipation efficiency of all-in-one computers in a limited space:
1. Optimize placement and physical heat dissipation
- Keep the bottom ventilated
Use a heat dissipation bracket or a self-made padding device (such as a bottle cap or a book) to raise the body by 1-2cm to increase the bottom air intake space.
Avoid placing the device in a closed cabinet or against a wall, ensure that there are no obstructions within 10cm around, and use the natural flow of air to dissipate heat.
- External active heat dissipation device
Use a low-noise heat dissipation base or a small USB fan to assist in heat dissipation at the back/bottom of the body.
2. Internal maintenance and hardware adjustment
- Regularly clean up dust accumulation
Remove the back cover every six months (refer to the model disassembly guide), and use a soft brush or compressed gas tank to clean the dust on the cooling fan and heat sink.
- Replace the thermal conductive medium
If the device has been used for more than 2 years, you can reapply high thermal conductivity silicone grease (such as Shin-Etsu 7921) to enhance the contact efficiency between the CPU/GPU and the heat dissipation module.
Paste copper heat sinks on the motherboard heating components (such as power supply modules) and passively dissipate heat through the metal D shell (make sure the internal space allows).
3. Software and usage habits optimization
Adjust the system power management to "energy saving mode" or use tools (such as Intel XTU) to limit the peak power consumption of CPU/GPU to reduce continuous high-load operation .
- Close non-essential background programs
Reduce processes that occupy resources such as browser tabs and self-starting software to avoid hardware overheating .
4. Low-cost DIY solution
- Improvement of air flow duct : Add plastic guide plates (such as cut beverage bottles) to the heat dissipation outlet to concentrate the air flow direction and improve the heat dissipation efficiency .
- Metal D shell auxiliary : If the body is made of metal, you can paste thermal conductive paste to transfer the internal heat to the outer shell and use the ambient air to dissipate heat naturally .
Through the above combination of solutions, the heat dissipation effect can be significantly improved in a limited space, while taking into account cost and safety. Note that the disassembly operation should be cautious. It is recommended to consult the equipment manual or consult a professional . Shenzhen Wandong's latest K11/K18 series all-in-one computer products use a unique cooling system. For more information, please visit www.wd-allinonepc.com